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preliminary product information 1 2004-02-24 xpak 1310 nm module 10 gigabit pluggable transceiver compatible with xpak msa rev. 2.3 v23833-g2104-a001 V23833-G6104-A001 preliminary data sheet fiber optics ordering information part number standard height connector laser class v23833-g2104-a001 fibre channel mezzanine sc 1 V23833-G6104-A001 ethernet mezzanine sc 1 file: 2104 features standards ? compatible with ieee 802.3ae?-2002 compatible with fibre channel 10gfc draft 3.5 compatible with xpak msa rev. 2.3 optical ieee ethernet: serial 1310 nm 10gbase-lr t11 fibre channel: serial 1310 nm 1200-sm-ll-l 10 gigabit fibre channel: 10.51875 gbit/s (v23833-g2104-a001) 10 gigabit ethernet: 10.3125 gbit/s (V23833-G6104-A001) transmission distance up to 10 km 1) uncooled directly modulated distributed feedback (dfb) laser at 1310 nm sc connector, single mode fiber (alternate product available with lc connector for multimode fiber applications) full duplex transmission mode 1) maximum reach as defined by ieee. longer reach possible depending upon link implementation.
v23833-g2104-a001 V23833-G6104-A001 applications preliminary product information 2 2004-02-24 dom ? loss of signal from receiver ? laser safety alarm (with reset function) ? supply voltage monitor ?transmit power ? module temperature ? received power ? transmit bias current monitor mechanical mezzanine profile: 2.68" l x 1.42" w x 0.38" h (68.07 mm x 35.99 mm x 9.8 mm) mezzanine module height for pci card applications and mid-board mounting belly-to-belly applications de-latch mechanism with low extraction force built-in heat sink electrical hot pluggable power supply: +5.0 v, +3.3 v, adaptable power supply (aps: +1.8 v) total power consumption: 3.3 w typical xaui electrical interface 10.3125 gbit/s ethernet serial data rate (v23833-g61xx-xxxx) 10.51875 gbit/s fibre channel serial data rate (v23833-g21xx-xxxx) management and control via mdio 2-wire bus 70-pin connector applications 10 gbit/s ethernet and fibre channel transmission systems for long range (lr) integration on pci card mid-board mounting belly-to-belly for high density applications enterprise and campus network applications storage applications backplane and switch applications core and edge routers aggregation point for lower date rate xpak evaluation kit v23833-g9909-z001 available upon request
v23833-g2104-a001 V23833-G6104-A001 pin configuration preliminary product information 3 2004-02-24 pin configuration figure 1 xpak transceiver electrical pad layout 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 prtad2 prtad1 prtad0 vend specific aps set reserved aps sense aps aps 3.3 v 3.3 v 5.0 v gnd gnd gnd gnd 5.0 v 3.3 v 3.3 v aps aps lasi reset vend specific tx on/off reserved mod detect vend specific vend specific mdio mdc prtad4 prtad3 gnd gnd gnd gnd gnd 70 69 53 52 51 49 48 47 46 45 44 43 42 40 39 38 37 36 50 41 reserved reserved gnd tx lane3? tx lane3+ gnd tx lane2? tx lane2+ gnd tx lane1? tx lane1+ gnd tx lane0? tx lane0+ 68 67 66 65 64 63 62 61 59 58 57 56 55 60 gnd 54 gnd rx lane2? rx lane2+ gnd rx lane1? rx lane1+ gnd rx lane0? rx lane0+ gnd reserved reserved rx lane3? rx lane3+ gnd 1 2 3 4 5 6 7 8 9 gnd gnd toward bezel top of transceiver pcb bottom of transceiver pcb (as viewed through top) file: 2301
v23833-g2104-a001 V23833-G6104-A001 pin configuration preliminary product information 4 2004-02-24 connector pin assignments pin no. signal name pin no. signal name 1gnd 70gnd 2gnd 69gnd 3 gnd 68 reserved 4 +5.0 v dc power 67 reserved 5 +3.3 v dc power 66 gnd 6 +3.3 v dc power 65 tx lane3? 7 aps 64 tx lane3+ 8 aps 63 gnd 9 lasi 62 tx lane2? 10 reset 61 tx lane2+ 11 vendor specific 60 gnd 12 tx on/off 59 tx lane1? 13 reserved 58 tx lane1+ 14 mod detect 57 gnd 15 vendor specific 56 tx lane0? 16 vendor specific 55 tx lane0+ 17 mdio 54 gnd 18 mdc 53 gnd 19 prtad4 52 gnd 20 prtad3 51 rx lane3? 21 prtad2 50 rx lane3+ 22 prtad1 49 gnd 23 prtad0 48 rx lane2? 24 vendor specific 47 rx lane2+ 25 aps set 46 gnd 26 reserved 45 rx lane1? 27 aps sense 44 rx lane1+ 28 aps 43 gnd 29 aps 42 rx lane0? 30 +3.3 v dc power 41 rx lane0+ 31 +3.3 v dc power 40 gnd 32 +5.0 v dc power 39 reserved 33 gnd 38 reserved 34 gnd 37 gnd 35 gnd 36 gnd
v23833-g2104-a001 V23833-G6104-A001 pin configuration preliminary product information 5 2004-02-24 pin description signal name level i/o pin no. description management and monitoring ports mdio open drain i/o 17 management data i/o. requires external 10 - 22 k ? pull-up to 1.8 v on host. mdc 1.2 v cmos i 18 management data clock input prtad4 1.2 v cmos i 19 port address input bit 4 prtad3 1.2 v cmos i 20 port address input bit 3 prtad2 1.2 v cmos i 21 port address input bit 2 prtad1 1.2 v cmos i 22 port address input bit 1 prtad0 1.2 v cmos i 23 port address input bit 0 lasi open drain o 9 link alarm status interrupt output. open drain compatible output with 10 - 20 k ? pull-up on host. logic high = normal operation logic low = status flag triggered reset open drain i 10 reset input. open drain compatible input with 10 k ? pull-up to aps internal to transceiver. logic high = normal operation logic low = reset note: 1.8 v is aps vendor specific 11,15,16,24 vendor specific pins. leave unconnected when not used. tx on/off open drain i 12 tx on/off input. open drain compatible input with 10 k ? pull-up to aps internal to transceiver. logic high = transmitter on logic low = transmitter off note: 1.8 v is aps mod detect o 14 pulled low inside transceiver through a 1 k ? resistor to ground
v23833-g2104-a001 V23833-G6104-A001 pin configuration preliminary product information 6 2004-02-24 transmit functions reserved reserved i i 68 67 reserved for future use reserved for future use tx lane 3? tx lane 3+ ac-coupled, internally biased differential xaui i i 65 64 module xaui input lane 3? module xaui input lane 3+ tx lane 2? tx lane 2+ i i 62 61 module xaui input lane 2? module xaui input lane 2+ tx lane 1? tx lane 1+ i i 59 58 module xaui input lane 1? module xaui input lane 1+ tx lane 0? tx lane 0+ i i 56 55 module xaui input lane 0? module xaui input lane 0+ receive functions reserved reserved o o 38 39 reserved for future use reserved for future use rx lane 0+ rx lane 0? ac-coupled, internally biased differential xaui o o 41 42 module xaui output lane 0+ module xaui output lane 0? rx lane 1+ rx lane 1? o o 44 45 module xaui output lane 1+ module xaui output lane 1? rx lane 2+ rx lane 2? o o 47 48 module xaui output lane 2+ module xaui output lane 2? rx lane 3+ rx lane 3? o o 50 51 module xaui output lane 3+ module xaui output lane 3? pin description (cont?d) signal name level i/o pin no. description
v23833-g2104-a001 V23833-G6104-A001 pin configuration preliminary product information 7 2004-02-24 dc power gnd 0 v dc i 1,2,3,33,34, 35,36,37,40, 43,46,49,52, 53,54,57,60, 63,66,69,70 ground connection for signal ground on the module aps +1.8 v i 7,8,28,29 input from adaptive power supply aps sense +1.8 v o 27 aps sense output. connected to the aps input inside transceiver. aps set gnd i 25 feedback input from aps. connected to gnd through a zero ? resistor inside the transceiver. 3.3 v +3.3 v dc i 5,6,30,31 dc power input, +3.3 v dc, nominal 5.0 v +5.0 v dc i 4,32 dc power input, +5.0 v dc, nominal reserved 26 reserved for apd. do not connect. reserved 13 reserved. do not connect. pin description (cont?d) signal name level i/o pin no. description
v23833-g2104-a001 V23833-G6104-A001 description preliminary product information 8 2004-02-24 description system block diagram (10 gbit/s ethernet) figure 2 optical interface standard specifications ieee 802.3ae?-2002 clause 52, 10gbase-lr fibre channel 10gfc draft 3.5, 1200-sm-ll-l xpak msa 2.3 fiber type differential group delay maximum (ps) operating range (meters) 1) 1) operating range as defined by ieee and fibre channel standards. longer reach possible depending upon link implementation. b1.1 smf 10 2 to 10,000 b1.3 smf 10 2 to 10,000 hot swap control 10 gbit/s optical (single mode fiber) 10gbe mac + rs laser 64b/66b encoder/ decoder 8b/10b xgxs 4x 3.125 gbit/s serdes data management v cc 8b/10b xgxs 4x 3.125 gbit/s serdes xaui 4x 3.125 gbit/s 10 gbit/s serdes & cdr +cmu 70-pin edge connector bist mdio mdc management data interface dfb laser pin tia laser driver la file: 2302
v23833-g2104-a001 V23833-G6104-A001 description preliminary product information 9 2004-02-24 electrical interface standard specifications ieee 802.3ae?-2002 clause 45 & 47 xpak msa 2.3 environment: thermal management recommendations module can withstand and operate with case temperature of 75c for up to 96 hrs/yr. transceiver requires airflow across cooling fins. maximum airflow required per xpak msa is 3 m/s. actual airflow required to provide adequate cooling for infineon transceiver tbd. fibers and connectors the transceiver has lc or sc receptacles for both tx and rx distinguished by part number. the transceiver is designed for single mode lc or sc cables, 0 polished endface (pc). 70-pin connector the module interface connector is a 70-pin, printed circuit board edge connection with a 0.5 mm pitch. the appropriate mating connector for the customer pcb is a 70-pin smt, dual row, right angled, edge connector, 0.5 mm pitch (tycoamp part number 1367337-1, molex part number 74441-0003 or equivalent). cage requirement the cage assembly required to mount the xpak module is defined by the msa. there are two cage designs for the module, tall and mezzanine profile. for correct operation and emi design the correct cage size must be selected for the appropriate module. alternatively a flangeless cage design is specified where there is limited size. operating air inlet temperature: 0c - 50c operating airflow: 3 m/s maximum defined per xpak msa operating humidity: 0% - 95% rh non-condensing
v23833-g2104-a001 V23833-G6104-A001 description preliminary product information 10 2004-02-24 dom parameters parameter values unit min. typ. max. transceiver temperature monitor accuracy 1) 5c transmit bias current monitor accuracy 2) 10 % transmit power monitor accuracy 3) 3db receive power monitor accuracy 3) 3db 1) 0 to 70c case temperature. 2) 0 to 12.5 ma. 3) 0 to 6.5 mw. regulatory compliance feature standard comments esd: electrostatic discharge to the electrical pins (hbm) eia/jesd22-a114-b (mil-std 883d method 3015.7) class 1a (> 500 v) immunity: against electrostatic discharge (esd) to the module receptacle en 61000-4-2 iec 61000-4-2 discharges ranging from 2kv to 15 kv to the front end / faceplate / receptacle cause no damage to module (under recommended conditions). immunity: against radio frequency electromagnetic field en 61000-4-3 iec 61000-4-3 with a field strength of 3 v/m, noise frequency ranges from 10 mhz to 2 ghz. no effect on module performance between the specification limits. emission: electromagnetic interference (emi) fcc 47 cfr part 15, class b en 55022 class b cispr 22 noise frequency range: 30 mhz to 40 ghz radiated emission does not exceed specified limits when measured inside a shielding enclosure with msa conform cutout.
v23833-g2104-a001 V23833-G6104-A001 technical data preliminary product information 11 2004-02-24 technical data exceeding any one of these values may permanently destroy the device. absolute maximum ratings parameter symbol limit values unit min. max. storage ambient temperature 1) 1) non condensing. t as ?20 85 c operating ambient temperature 1) t ao 065c operating case temperature 1) t co 080c supply voltage +5.0 v v 5 06v supply voltage +3.3 v v 3 04v supply voltage aps v aps 02v static discharge voltage, all pins st d 500 v average receive optical power rx p max 1.5 dbm recommended operating conditions parameter symbol values unit min. typ. max. operating case temperature 1) 1) worst case thermal location, see figure 9 . t c 070c transceiver total power consumption p 3.3 3.5 w supply voltage +5.0 v v cc5 4.75 5.0 5.25 v supply current +5.0 v i cc5 50 ma supply voltage +3.3 v v cc3 3.14 3.3 3.47 v supply current +3.3 v i cc3 550 ma supply voltage aps v cc aps 1.746 1.8 1.854 v supply current aps i cc aps 700 ma
v23833-g2104-a001 V23833-G6104-A001 technical data preliminary product information 12 2004-02-24 optical characteristics ( v cc5 = 4.75 v to 5.25 v, v cc3 = 3.14 v to 3.47 v, v cc aps = 1.746 v to 1.854 v, t c = 0c to 70c) parameter symbol values unit min. typ. max. transmitter launch power in oma minus tdp p o-oma ?6.2 dbm average launch power p o-avg ?8.2 ?1 0.5 dbm center wavelength range c-tx 1290 1310 1330 nm spectral width (?20 db) i 0.5 0.6 nm side mode suppression ratio smsr 30 db extinction ratio er 3.5 5 db relative intensity noise 12 oma rin ?128 db/hz optical modulation amplitude (oma) oma ?5.2 dbm transmitter and dispersion penalty tdp 3.2 db average launch power of off transmitter p o-off ?30 dbm optical return loss tolerance orl t 12 db transmitter reflectance ref tx ?12 db eye mask definition according to ieee and fibre channel receiver stressed receiver sensitivity p in-s ?10.3 dbm sensitivity in oma 1) p in ?12.6 dbm average receive power p in-max 0.5 dbm loss of signal assert level p losa ?17 ?13 dbm loss of signal hysteresis p losh 124db receiver reflectance ref rx ?12 db center wavelength range c-rx 1260 1355 nm electrical 3 db upper cut-off frequency 3db co 12.3 ghz 1) receiver sensitivity is informative only. measured with an ideal transmitter.
v23833-g2104-a001 V23833-G6104-A001 technical data preliminary product information 13 2004-02-24 electrical dc characteristics ( v cc5 = 4.75 v to 5.25 v, v cc3 = 3.14 v to 3.47 v, v cc aps = 1.746 v to 1.854 v, t c = 0c to 70c) parameter symbol values unit min. typ. max. 1.2 v cmos (1.8 v cmos compatible 1) ) i/o dc characteristics (prtad; lasi; reset; tx_onoff) 1) for 1.8 v cmos v oh = 1.65 v min., v ol = 0.15 v max., v ih = 1.17 v min., v il = 0.63 v max. external pull-up resistor for open drain r pullup 10 22 k ? output high voltage 2) 2) r pull-up = 10 k ? to 1.8 v. v oh 1v output low voltage 2) v ol 0.15 v input high voltage v ih 0.84 1.854 v input low voltage v il 0.36 v input pull-down current 3) 3) v in = 1.8 v. i pd 20 120 a xaui i/o dc characteristics (txlane[0..3]; rxlane[0..3]) differential input amplitude (pk-pk) 4) 4) ac coupled. v in_xaui 200 2500 mv differential output amplitude (pk-pk) 4) v out_xaui 800 1600 mv mdio i/o dc characteristics (mdio; mdc) output low voltage 5) 5) i ol = 100 a. v ol ?0.3 0.2 v output low current i ol 4ma input high voltage v ih 0.84 1.854 v input low voltage v il ?0.3 0.36 v pull-up supply voltage v pu 1.746 1.8 1.854 v input capacitance c in 10 pf load capacitance c load 470 pf external pull-up resistance r load 200 ?
v23833-g2104-a001 V23833-G6104-A001 technical data preliminary product information 14 2004-02-24 electrical ac characteristicscharacteristics ( v cc5 = 4.75 v to 5.25 v, v cc3 = 3.14 v to 3.47 v, v cc aps = 1.746 v to 1.854 v, t c = 0c to 70c) parameter symbol values unit min. typ. max. xaui input ac characteristics (txlane[0..3]) baud rate r xauiin 3.125 gbit/s baud rate tolerance r tolxaui ?100 100 ppm differential input impedance z inxaui 80 100 120 ? differential return loss 1) | s 11 | 10 db input differential skew 2) t skewin 75 ps jitter amplitude tolerance 3) j xauitol xaui output ac characteristics (rxlane[0..3]) baud rate r xauiin 3.125 gbit/s baud rate variation r xauivar ?100 100 ppm rise and fall times 20% - 80% t r, t f 40 100 ps output differential skew t skewout 15 ps output differential impedance z outxaui 80 100 120 ? differential output return loss 1) | s 22 | 10 db total jitter 4) tj xaui 0.35 ui deterministic jitter 4) dj xaui 0.17 ui power-on reset ac characteristics power-on reset and tx_onoff characteristics according to xenpak msa issue 3.0 draft 4.0, 2002-9-9 mdio i/o ac characteristics (mdio; mdc) mdio data hold time t hold 10 ns mdio data setup time t su 10 ns delay from mdc rising edge to mdio data change t delay 300 ns mdc clock rate f max 2.5 mhz 1) 100 mhz to 2.5 ghz. 2) at crossing point. 3) per ieee 802.3ea. 4) at near-end. no pre-equalization. 1 ui = 320 ps.
v23833-g2104-a001 V23833-G6104-A001 eye safety preliminary product information 15 2004-02-24 eye safety this laser based single mode transceiver is a class 1 product. it complies with iec 60825-1 and fda 21 cfr 1040.10 and 1040.11 except for deviations pursuant to laser notice 50, dated july 26, 2001. to meet laser safety requirements the transceiver shall be operated within the absolute maximum ratings. attention: all adjustments have been made at the factory prior to shipment of the devices. no maintenance or alteration to the device is required. tampering with or modifying the performance of the device will result in voided product warranty. note: failure to adhere to the above restrictions could result in a modification that is considered an act of ?manufacturing?, and will require, under law, recertification of the modified product with the u.s. food and drug administration (ref. 21 cfr 1040.10 (i)).
v23833-g2104-a001 V23833-G6104-A001 application notes preliminary product information 16 2004-02-24 application notes pcb cage footprints figure 3 standard mounting figure 4 belly-to-belly mounting dimensions in mm [inches] file: 2203 dimensions in mm [inches] file: 2204
v23833-g2104-a001 V23833-G6104-A001 application notes preliminary product information 17 2004-02-24 host board layouts figure 5 host pcb, board connector layout and bezel opening 35.51 [1.398] 35.51 [1.398] 41.91 [1.65] 40.23 [1.584] 41.91 [1.65] 38.1 [1.5] 4.24 [.167] 1.02 [.04] 1) 2) 0.51 [.02] 3) 39.12 0.12 [1.54 .005] 1) 2) 36.5 0.12 [1.437 .005] 3) 1) tall profile 2) low profile 3) flangeless ? 0.25 [.01] g h j 25.3 0.12 [.996 .005] 1) 12.85 0.12 [.506 .005] 2) 10.31 0.12 [.406 .005] 3) 11.76 [.463] 1) 6.4 [.252] 2) 6.43 [.253] 3) 65.66 [2.585] 62.36 [2.455] 55.88 [2.2] 47.8 [1.882] 31.75 [1.25] 19.05 [.75] 44.07 [1.735] ? 0.15 [.006] g h j 10x ? 2 0.08 [.079 .003] h j g 59.69 [2.35] 44.45 [1.75] 55.88 [2.2] 38.1 [1.5] 12.7 [.5] 25.4 [1] 6.6 0.38 [.26 .015] 1) 2) 7.39 0.38 [.291 .015] 3) 3.94 [.155] 9.14 [.36] 1) 2) 6.35 [.25] dimensions in mm [inches] file: 2504 29.6 14.8 ? 1.55 0.05 13.8 13.8 13.4 13.4 4.1 4.1 pad detail see below 0.5 0.03 (70x) 0.8 (34x) 2 0.05 (70x) pad detail pad spacing
v23833-g2104-a001 V23833-G6104-A001 application notes preliminary product information 18 2004-02-24 figure 6 host board pad layout 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 upper row toward bezel lower row prtad2 prtad1 prtad0 vend specific aps set reserved aps sense aps aps 3.3 v 3.3 v 5.0 v gnd gnd gnd gnd 5.0 v 3.3 v 3.3 v aps aps lasi reset vend specific tx on/off reserved mod detect vend specific vend specific mdio mdc prtad4 prtad3 gnd gnd gnd gnd gnd gnd gnd reserved reserved gnd tx lane3 ? tx lane3+ gnd tx lane2 ? tx lane2+ gnd tx lane1 ? tx lane1+ gnd tx lane0 ? tx lane0+ gnd gnd rx lane2 ? rx lane2+ gnd rx lane1 ? rx lane1+ gnd rx lane0 ? rx lane0+ gnd reserved reserved rx lane3 ? rx lane3+ gnd gnd file: 2505
v23833-g2104-a001 V23833-G6104-A001 package outlines preliminary product information 19 2004-02-24 package outlines figure 7 mechanical dimensions dimensions in mm file: 2202
v23833-g2104-a001 V23833-G6104-A001 package outlines preliminary product information 20 2004-02-24 figure 8 label description laser class optional marking (ms/es) country of origin description part number yyyy: ww: nnnnnnnn: mmmmm: 2.6 17.45 year of production week of production serial number month of production 8.5 33.5 dimensions in mm file: 2401
v23833-g2104-a001 V23833-G6104-A001 package outlines preliminary product information 21 2004-02-24 figure 9 xpak temperature reference point dimensions in mm file: 2205
edition 2004-02-24 published by infineon technologies ag, st.-martin-strasse 53, 81669 mnchen, germany ? infineon technologies ag 2004. all rights reserved. attention please! the information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. terms of delivery and rights to technical change reserved. we hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. v23833-g2104-a001 V23833-G6104-A001 revision history: 2004-02-24 ds1 previous version: 2003-08-22 page subjects (major changes since last revision) 1 features optical changed 2 features mechanical changed 5 , 12 , 13 , 14 tables changed 10 table ? regulatory compliance ? changed

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